telephone34  +49 (0) 5183 - 9405-0

Production range

electronics s    PCB - Technology

  • Single Sided Boards
  • Plated-through boards
  • Multilayer up to 12 Layers
  • Multilayer with blind and/or buried vias
  • PCB with an integrated RFID module
  • Insulated metal substrat (IMS) PCB (aluminium)
  • Rigidflex- and semiflexible circuits
  • Flexible printed circuit boards

Quality Management    Quality Management
  • E-testing (adapter- and fingertest)
  • AOI-test (Automatic-Optical-Inspection)
  • UL®-identification (on demand)
  • Micro section analysis (quality control)
  • MMS-control for the copper thickness
letter27 s    Surface Finishing

  • Hot-Air-Leveling (HAL) - leaded or lead-free
  • Electroless Nickel Immersion Gold (ENIG)
  • Electroless Nickel - Palladium Immersion Gold (ENIPIG) -bondable
  • Immersion Tin
  • galvanic gold plating (partially/completely)
  • Goldplating for edge connectors
  • Organic Surface Protection (OSP)
  • Immersion Silver   

electronic47 s    Coating / Masks
  • Solder resist (ELPEMER®, different colours)
  • Peelable Solder resist
  • Assembly Print (different colours available)
  • Conductive Carbon Inks
  • Via Fill Materials




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