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Technical Information

pcb track width     PCB Track Width and Spacing
 
 Spacing (Outer/Inner Layers)
 Track Width (Outer/Inner Layers)
 Pad diameter (Outer/Inner Layers)
 Layer spacing ML
 SMT Pad
 Component spacing
 Mikrovias Drilling Technology
 >= 0,063 mm
 >= 0,063 mm
 >= 0,35 mm
 >= 0,05 mm
 >= 0,2 mm
 >= 0,37 mm
 0,1 - 0,2 mm   
pcb dimensions   PCB Dimensions
 
 Maximum Boardsize
 Maximum Boardsize ML
 Maximum thickness
 Minimum thickness
 490 x 580 mm
 405 x 525 mm
 3,50 mm
 0,10 mm

Final Copper Plating Thickness  Final Copper Thickness
 
 Standard
 Minimum
 Maximum
 Drilling sleeve
 35 µm / 70 µm
 9 µm
 235 µm
 > 25 µm
Drilling & Milling Parameters  Drilling & Milling Parameters
 
 Aspect ratio borehole/depth/diameter
 End diameter DK
 Milling diameter
 Material thickness -scoring technique
 Blind hole drilling diameter
 Blind hole pad diameter
 Aspect ratio blind hole

 12 : 1
 >= 0,1 mm
 >= 0,6 mm
 >= 0,5 mm
 >= 0,2 mm
 >= 0,35 mm
 1 : 1
Coating Clearances   Coating Clearances
 
 Solder mask relief
 Strip varnish cover
 Strip varnish clearance
 > 0,05 mm
 > 0,3 mm
 > 0,6 mm
PCB Materials   PCB Materials 
 
 All FR4*
 Rogers®**
 Polyimide**
 Aluminium (Copper-laminated)**

 *   For UL-PCB´s, not all
     materials can be used.

 **  No UL-Certification
        
Download an detailed fact sheet "Technical Data" here

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