Technical Information

PCB Track Width & Spacing
Spacing (Outer/Inner Layers) Track Width (Outer/Inner Layers) Pad diameter (Outer/Inner Layers) Layer spacing ML SMT Pad Component spacing Mikrovias Drilling Technology	>= 0,063 mm >= 0,063 mm >= 0,35 mm >= 0,05 mm >= 0,2 mm >= 0,37 mm 0,1 - 0,2 mm
PCB Dimensions
Maximum Boardsize Maximum Boardsize ML Maximum thickness Minimum thickness	490 x 580 mm 405 x 525 mm 3,50 mm 0,10 mm
Final Copper Thickness
Standard Minimum Maximum Drilling sleeve	35 µm / 70 µm 9 µm 235 µm > 25 µm
Drilling & Milling Parameters
Aspect ratio borehole/depth/diameter End diameter DK Milling diameter Material thickness -scoring technique Blind hole drilling diameter Blind hole pad diameter Aspect ratio blind hole	12 : 1 >= 0,1 mm >= 0,6 mm >= 0,5 mm >= 0,2 mm >= 0,35 mm 1 : 1
Coating Clearances
Solder mask relief Strip varnish cover Strip varnish clearance	> 0,05 mm > 0,3 mm > 0,6 mm
PCB Materials
All FR4* Rogers® Polyimide Aluminium (Copper-laminated)**	* For UL-PCB´s, not all materials can be used. ** No UL-Certification
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