Ultra Fine Line Technology / Blind Vias
The future of the PCB technology doesn’t only mean more layers, but also a reduction in the form factor.
Ultra-fine line technology with a track width and spacing of <120 µm each and the use of blind vias for internal connections offer another chance to minimise the board.
The blind via technology is a viable design technique to help meet the density constraints of lines and pads. Blind via-holes allow a targeted connection to the inner layers. An end of the development of ultra-fine lines and smaller holes is not in sight.
We are happy to advise you on these new technologies. Together we´ll find the best solution for your individual needs. We look forward to hearing from you !